System, Module and Component Level Reliability

Dynamic Environmental Test • Temperature & Humidity (Damp Heat) • Dry Heat • Low Temperature • Temperature Cycle • Thermal Shock • Temperature, High Altitude, Low Air Pressure • Salt Spray Mechanical Stress • Pull / Shear • Board Bending • Torque • Connector Life • Dye / Pry • Durability / Mating Test         Pb-free Reliability Engineering • Lead-free Reliability Introduction • Assembly Inspection • Lead-free Component Reliability • Lead-free System Reliability       Industrial / Outdoor Environmental Test • Gas Corrosion Test (Flowing Mixed Gas)

Climatic Environmental Tests • Vibration • Mechanical Shock • Bump & Bounce • Drop Test • Seismic / Earthquake Vibration     Component Reliability • Heat Resistance & Solderability • Thermal Shock (Air to Air & Liquid to Liquid) • Moisture Sensitivity Level • ESD & Latch-up • Operation Life Test • Highly Accelerated Stress Test • Pressure Cook • Preconditioning • Vibration • Mechanical Shock Failure Analysis • Electrical Property Analysis • BGA Solder Ball Inspection • X-Ray Inspection • 3D CT X-Ray • Scanning Acoustic Tomography (SAT) • Cross Section • Material Analysis Design Verification • HALT/ HASS • Reliability Demonstration (MTBF) • Acoustic Noise (Sound Pressure & Sound Power)   Alternate Energy Qualification • Early Test & Reliability Validation • Compliance to IEC, IEEE, ASTM, UL, UN